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Capabilities &
Specs. |
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| Layers: |
1 to 20 Layers |
| Base Materials: |
XPC FR1 FR2 CEM1 CEM3 , FR4, High TG FR4 |
| Base Copper Thickness: |
1OZ oz. to 3 oz. |
| BoardThickness: |
0.4mm-3.2mm |
| Maximum Panel Size: |
406mm x 610mm |
| Minimum Hole Diameter: |
0.3mm |
| PTH Hole Tolerance: |
0.05mm |
| Aspect Ratio: |
6:1 |
| Blind or Buried Via: |
no |
| Minimum Line Width: |
0.1mm |
| Minimum Line Spacing: |
0.1mm |
| Minimum Bonding Pitch: |
0.127mm |
| Minimum SMT Pitch: |
0.40mm " (center to center) |
| Mechanical Fabrication: |
Minimum Hole registration tolerance (NPTH):
+/-0.076
Minimum Hole registration tolerance (PTH):
+/-0.076mm
Minimum Pattern registration tolerance:
+/-0.076mm
Minimum S/M registration tolerance (LPI):
+/-0.076mm
Minimum Annular ring: +/-0.1mm(
artwork)
Minimum S/M bridge (LPI): 0.1mm
Plated
gold thickness: 0.01um – 0.025um
Immersion gold
thickness: 0.025um -- 0.2um |
| Electrical Testing: |
Voltage: 24V - 300V
ontinuity:5 - 100Ohms
Twist and Warp: Less than 1%
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 Download Capabilities & Specifications(WORD)
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